Embedded power module

ABSTRACT

A transport system in a structure includes a car and a plurality of motor modules. The car is constructed and arranged to move along a lane generally defined at least in-part by the structure. The plurality of motor modules are distributed along the lane and are constructed and arranged to propel the car. Each one of the pluralities of motor modules include an embedded power module.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Divisional Application of U.S. Non-Provisionalapplication Ser. No. 15/205,936, filed Jul. 8, 2016, which isincorporated by reference in its entirety herein.

BACKGROUND

The present disclosure relates to an embedded power module, and moreparticularly to an embedded power module of a transport system.

Typical power module designs, such as those used in transport systems(e.g., elevators, escalators, and others), include silicon insulatedgate bipolar transistors (IGBT) and diodes. The semiconductor devicesmay be attached to a ceramic substrate and wire bonded to form thenecessary electrical connections. The assembly may then be placed in aplastic housing that is connected to the user design application throughscrew terminals or press fit pins.

SUMMARY

An embedded power module according to one, non-limiting, embodiment ofthe present disclosure includes a substrate including opposite first andsecond surfaces; a first semiconducting die embedded in the substrateand spaced between the first and second surfaces; a secondsemiconducting die embedded in the substrate, spaced between the firstand second surfaces, and spaced from the first semiconducting die; afirst gate located on the first surface; a second gate located on thesecond surface; a first via electrically engaged to the first gate andthe second semiconducting die; and a second via electrically engaged tothe second gate and the first semiconducting die.

Additionally, to the foregoing embodiment, a first conductor pad locatedon the second surface and spaced from the second gate; at least onethird via electrically engaged to the first semiconducting die and thefirst conductor pad; and at least on fourth via electrically engaged tothe second semiconducting die and the first conductor pad.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module includes a second conductor pad located on thefirst surface; a third conductor pad located on the first surface andspaced from the first conductor pad; at least one fifth via electricallyengaged to the first semiconducting die and the second conductor pad;and at least one sixth via electrically engaged to the secondsemiconducting die and the third conductor pad.

In the alternative or additionally thereto, in the foregoing embodiment,the first conductor pad is a phase conductor pad, the second conductorpad is a direct current (DC) plus pad, and the third conductor pad is aDC minus pad.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module includes a capacitor electrically connectedbetween the second and third conductor pads.

In the alternative or additionally thereto, in the foregoing embodiment,the first and second semiconducting dies are semiconductor devices.

In the alternative or additionally thereto, in the foregoing embodiment,the first, second and third conductor pads are collector/emitter pads.

In the alternative or additionally thereto, in the foregoing embodiment,at least one of the first second and third conductor pads are configuredto provide at least one of electrical shielding and substrate cooling.

In the alternative or additionally thereto, in the foregoing embodiment,at least one of the first, second and third conductor pads are coppertraces.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module includes at least one isolated trace locatedon at least one of the first and second surfaces for shielding.

In the alternative or additionally thereto, in the foregoing embodiment,the first, second, third, fourth, fifth, and sixth vias are printedcircuit board (PCB) vias.

In the alternative or additionally thereto, in the foregoing embodiment,the at least one third via is two vias, the at least one fourth via isthree vias, the at least one fifth via is three vias, and the at leastone sixth via is two vias.

In the alternative or additionally thereto, in the foregoing embodiment,the substrate is non-conductive.

In the alternative or additionally thereto, in the foregoing embodiment,the substrate is a ceramic.

In the alternative or additionally thereto, in the foregoing embodiment,the motor second and third conductor pads connect to respectivealternating current (AC) pads.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module is selected from the group consisting of abattery charger, a transport system, a propulsion system, a compressordrive, a pump drive, and a fan drive.

A transport system in a structure and in accordance with another,non-limiting, embodiment includes a car constructed and arranged to movealong a lane generally defined at least in-part by the structure; and aplurality of motor modules distributed along the lane and constructedand arranged to propel the car, each one of the pluralities of motormodules including an embedded power module.

Additionally to the foregoing embodiment, the embedded power moduleincludes a substrate having opposite first and second surfaces; a firstsemiconductor device embedded in the substrate and spaced between thefirst and second surfaces; a second semiconductor device embedded in thesubstrate, spaced between the first and second surfaces, and spaced fromthe first semiconductor device; a first gate located on the firstsurface; a second gate located on the second surface; a first viaelectrically engaged to the first gate and the second semiconductordevice; and a second via electrically engaged to the second gate and thefirst semiconductor device.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module includes a first collector/emitter pad locatedon the second surface and spaced from the second gate; at least onethird via electrically engaged to the first semiconductor device and thefirst collector/emitter pad; and at least on fourth via electricallyengaged to the second semiconductor device and the firstcollector/emitter pad.

In the alternative or additionally thereto, in the foregoing embodiment,the embedded power module includes a second collector/emitter padlocated on the first surface; a third collector/emitter pad located onthe first surface and spaced from the first collector/emitter pad; atleast one fifth via electrically engaged to the first semiconductordevice and the second collector/emitter pad; and at least one sixth viaelectrically engaged to the second semiconductor device and the thirdcollector/emitter pad

The foregoing features and elements may be combined in variouscombinations without exclusivity, unless expressly indicated otherwise.These features and elements as well as the operation thereof will becomemore apparent in light of the following description and the accompanyingdrawings. However, it should be understood that the followingdescription and drawings are intended to be exemplary in nature andnon-limiting.

BRIEF DESCRIPTION OF THE DRAWINGS

Various features will become apparent to those skilled in the art fromthe following detailed description of the disclosed non-limitingembodiments. The drawings that accompany the detailed description can bebriefly described as follows:

FIG. 1 depicts a transport system as one non-limiting embodimentutilizing an exemplary embodiment of an embedded power module of thepresent disclosure;

FIG. 2 is a top down view of a car and portions of a propulsion systemof the transport system;

FIG. 3 is a schematic of the propulsion system;

FIG. 4 is a cross section of the embedded power module of the transportsystem; and

FIG. 5 is an exploded perspective view of the embedded power module.

DETAILED DESCRIPTION

FIG. 1 depicts a self-propelled or ropeless elevator system as one,non-limiting, example of a transport system 20. The transport system 20is one, non-limiting, example of an application of an embedded powermodule 21 in an embodiment of the present disclosure. The ropelesselevator system 20 may be used in a structure or building 22 havingmultiple levels or floors 24. Elevator system 20 includes a hoistway 26defined by boundaries carried by the structure 22, and at least one car28 adapted to travel in the hoistway 26. The hoistway 26 may include,for example, three lanes 30, 32, 34 with any number of cars 28 travelingin any one lane and in any number of travel directions (e.g., up anddown). For example, and as illustrated, the cars 28 in lanes 30, 34, maytravel in an up direction and the cars 28 in lane 32 may travel in adown direction. It is further contemplated and understood that othertransport systems 20 may include escalators, mono-rails, and othersystems traveling in any number of directions.

Pertaining to the example of an elevator system 20 in the building 22,above the top floor 24 may be an upper transfer station 36 thatfacilitates horizontal motion to elevator cars 28 for moving the carsbetween lanes 30, 32, 34. Below the first floor 24 may be a lowertransfer station 38 that facilitates horizontal motion to elevator cars28 for moving the cars between lanes 30, 32, 34. It is understood thatthe upper and lower transfer stations 36, 38 may be respectively locatedat the top and first floors 24 rather than above and below the top andfirst floors, or may be located at any intermediate floor. Yet further,the elevator system 20 may include one or more intermediate transferstations (not illustrated) located vertically between and similar to theupper and lower transfer stations 36, 38.

Referring to FIGS. 1 and 2, the cars 28 are propelled using a propulsionsystem 40 such as a linear propulsion system. The propulsion system 40may include two linear, magnetic, propulsion motors 42 that may begenerally positioned on opposite sides of the elevator cars 28, and acontrol system 44 (see FIG. 3). Each motor 42 may include a fixedprimary portion 46 generally mounted to the building 22, and a movingsecondary portion 48 mounted to the elevator car 28. More specifically,the primary portions 46 may be located within the lanes 30, 32, 34 onwalls or sides of the building 22 generally not associated with anelevator door.

Each primary portion 46 includes a plurality of windings or coils 50(i.e. phase windings) that generally form a row extending longitudinallyalong and projecting laterally into each of the lanes 30, 32, 34. Eachsecondary portion 48 may include two rows of opposing permanent magnets52A, 52B mounted to each car 28. The plurality of coils 50 of theprimary portion 46 are generally located between and spaced from theopposing rows of permanent magnets 52A, 52B. It is contemplated andunderstood that any number of secondary portions 48 may be mounted tothe car 28, and any number of primary portions 46 may be associated withthe secondary portions 48 in any number of configurations. It is furtherunderstood that each lane may be associated with only one linearpropulsion motor 42, or three or more motors 42. Yet further, theprimary and secondary portions 46, 48 may be interchanged.

The secondary portion 48 operatively engages with the primary portion 46to support and drive the elevators cars 28 within the lanes 30, 32, 34.Primary portion 46 is supplied with drive signals from one or moredrives 54 of the control system 44 to control movement of elevator cars28 in their respective lanes through the linear, permanent magnet motorsystem 40. The secondary portion 48 operatively connects with andelectromagnetically operates with the primary portion 46 to be driven bythe signals and electrical power. The driven secondary portion 48enables the elevator cars 28 to move along the primary portion 46 andthus move within a lane 30, 32, 34.

The primary portion 46 may be formed from a plurality of motor segmentsor modules 56, with each module associated with a drive 54 of thecontrol system 44. Although not shown, the central lane 30 (see FIG. 1)also includes a drive for each module 56 of the primary portion 46 thatis within the lane 30. Those with ordinary skill in the art willappreciate that although a drive 54 is provided for each motor module 56of the primary portion 46 (one-to-one) other configurations may be usedwithout departing from the scope of this disclosure.

Referring to FIGS. 2 and 3, a view of the elevator system 20 includingthe elevator car 28 that travels in lane 30 is shown. The elevator car28 is guided by one or more guide rails 58 extending along the length oflane 30, where the guide rails 58 may be affixed to a structural member60 that may also support the coils 52A, 52B of the primary portion 46.The primary portion 46 may be mounted to the guide rail 58, incorporatedinto the guide rail 58, or may be located apart from guide rail 54 onstructural member 60 (as shown). The primary portion 46 serves as astator of a permanent magnet synchronous linear motor to impart force toelevator car 28. Coils 50 of motor modules 56 (four illustrated andidentified as 56 a, 56 b, 56 c, and 56 d) may be arranged in threephases, as is known in the electric motor art. One or more primaryportions 46 may be mounted in the lane 30, to co-act with permanentmagnets 52A, 52B mounted to the elevator car 28.

Each of the motor modules 56 a, 56 b, 56 c, 56 d may have acorresponding or associated drive 54 a, 54 b, 54 c, 54 d of the controlsystem 40. A system controller 62 provides drive signals to the motormodules 56 a, 56 b, 56 c, 56 d via respective drives 54 a, 54 b, 54 c,54 d to control motion of the elevator car 28. The system controller 62may be implemented using a microprocessor executing a computer programstored on a storage medium to perform the operations described herein.Alternatively, the system controller 62 may be implemented in hardware(e.g., application specific integrated circuit, and field programmablegate array) or in a combination of hardware/software. The systemcontroller 62 may include power circuitry (e.g., an inverter or drive)to power the primary portion 46 of the linear motor 42. Although asingle system controller 62 is depicted, it will be understood by thoseof ordinary skill in the art that a plurality of system controllers maybe used. For example, a single system controller may be provided tocontrol the operation of a group of motor modules over a relativelyshort distance, and in some embodiments a single system controller maybe provided for each drive or group of drives, with the systemcontrollers in communication with each other.

In order to drive the elevator car 28, one or more motor modules 56 a,56 b, 56 c, 56 d may be configured to overlap the secondary portion 48secured to the elevator car 28 at any given point in time. For example,and as illustrated in FIG. 3, motor module 56 d partially overlaps thesecondary portion 48 (e.g., about 33% overlap of the module), motormodule 56 c fully overlaps the secondary portion 48 (100% overlap of themodule), and motor module 56 d partially overlaps the secondary portion48 (e.g., about 66% overlap of the module). There is no depicted overlapbetween motor module 56 a and the secondary portion 48. In someembodiments, the control system 44 (i.e., system controller 62 andon-board controller 64) is operable to apply an electrical current to atleast one of the motor modules 56 b, 56 c, 56 d that overlaps thesecondary portion 48. The system controller 62 may control theelectrical current on one or more of the drives 54 a, 54 b, 54 c, 54 dwhile receiving data from an on-board controller 64 via a transceiver 66based on a load sensor 70 in the car 28. The electrical current mayinduce an upward thrust force (see arrow 74) to the elevator car 28 byinjecting a constant current, thus propelling the elevator car 28 withinthe lane 30. The thrust produced by the propulsion system 40 isdependent, in part, on the amount of overlap between the primary portion46 with the secondary portion 48. The peak thrust is obtained when thereis maximum overlap of the primary portion 46 and the secondary portion48.

Referring to FIG. 4, each drive 54 may include at least one embeddedpower module 21 that may be into the motor module 56 and is configuredto provide power from a source to the motor module 56. The embeddedpower module 21 may include: a substrate 78; first and second gates 80,82; first and second semiconducting dies 84, 86; first, second, andthird conductor pads 88, 90, 92; and first, second, third, fourth, fifthand sixth vias 94, 96, 98, 100, 102, 104. The substrate 78 may include afirst surface 106 and a second surface 108 that may face substantiallyin an opposite direction from the first surface. The substrate 78 may bemade of an electrically non-conductive material such as, for example,ceramic. It is contemplated and understood that the embedded powermodule 21 in alternative embodiments may be incorporated into the othermotor structures associated with the motor module 56.

The first and second gates 80, 82 facilitate the switching ‘on’ or ‘off’of the semiconductor dies 84, 86, with the first gate 80 mounted oradhered to the first surface 106 of the substrate 78 and the second gate82 mounted or adhered to the second surface 108. The first and secondsemiconducting dies 84, 86 may be semiconductor devices. Morespecifically, the first and second dies 84, 86 may be silicon insulatedgate bipolar transistors (IGBT), or metal-oxide semiconductorfield-effect transistors (MOSFET), configured to facilitate the outputcurrent and is connected to the load. Both the first and secondsemiconducting dies 84, 86 are generally embedded (i.e., suspended)within the substrate 78, are spaced from one-another, and are spacedfrom the opposite surfaces 106, 108. It is further contemplated andunderstood that either die 84, 86 may be a diode; however, is such anexample there would be no gate connection present.

The first, second, and third conductor pads 88, 90, 92 may becollector/emitter pads for the example of IGBTs and may be drain/sourcepads for the example of MOSFETs. The first conductor pad 88 may be aphase pad that facilitates the output current and is connected to theload and is mounted or adhered to the second surface 108 of thesubstrate 78. The second conductor pad 90 may be a direct current (DC)plus pad and is mounted or adhered to the first surface 106 of thesubstrate 78. Both conductor pads 88, 90 facilitate connection to a DClink of the power module 21. The third conductor pad 92 may be a DCminus pad and is mounted or adhered to the first surface 106 and spacedfrom the second conductor pad 90. The conductor pads 88, 90, 92 may becopper traces and/or may be sized to also function as electricalshielding and/or thermal cooling pads to dissipate heat. It iscontemplated and understood that the second and third conductor pads 90,92 may be configured to connect to respective alternating current (AC)pads of any variety of drive units, motors, and the like.

The vias 94, 96, 98, 100, 102, 104 may generally be printed circuitboard (PCB) vias and facilitate the electrical connections betweencomponents and at least partially through the substrate 78. The firstvia 94 may electrically connect the first gate 80 to the secondsemiconducting die 86. The second via 96 may electrically connect thesecond gate 82 to the first semiconducting die 84. The third via(s) 98(i.e., two illustrated) may each electrically connect the firstconductor pad 88 to the first semiconducting die 84. The fourth via(s)100 (i.e., three illustrated) may each electrically connect the firstconductor pad 88 to the second semiconducting die 86. The fifth via(s)102 (i.e., three illustrated) may each electrically connect the secondconductor pad 90 to the first semiconducting die 84. And, the sixthvia(s) 104 (i.e., two illustrated) may each electrically connect thethird conductor pad 92 to the second semiconducting die 86.

The embedded power module 21 may further include a capacitor 110 thatfunctions as a DC storage element. The capacitor 110 may provide theenergy required during switching of the dies 84, 86, and the energyrequired by the power module 56 during load transients. The capacitor110 may be electrically connected to the second and third conductor pads90, 92, and may not be embedded in the substrate 78. In addition to theconductor pads 88, 90, 92, the embedded power module 21 may include oneor more electrically isolated pads 112 (i.e., not connected to a via)secured to one or both of the surfaces 106, 108 of the substrate 78 forelectrical shielding purposes.

It is further contemplated and understood that the embedded power module21 may be used in any variety of power electronic converters. Theembedded power module 21 may further be a drive used for any variety oftransport systems, for example, as used in the propulsion systems ofcars, trains, and the like, and is not limited to elevators. Further,the embedded power module 21 may be used in drives configured to drive acompressor, pump, fan, and the like. Still further, non-limitingexamples of the embedded power module 21 includes power supplies,battery chargers, power conditioning systems, and the like.

Advantages and benefits of the present disclosure include an embeddedpower module that may integrate power and control stages of electricalcircuits in one step, and a module with novel orientations of thedevices in the phase leg to minimize loop inductance toward improvementin switching speed and reduced loss. Moreover, the present orientationenables closer spacing of gate drive circuits to the devices forimproved switching, and the use of metallic pads that enhance cooling.Other advantages may include improved reliability by minimizing oreliminating solder and/or wire bonds, reduced manufacturing costs, andimproved packaging and robustness.

While the present disclosure is described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made, and equivalents may be substituted withoutdeparting from the spirit and scope of the present disclosure. Inaddition, various modifications may be applied to adapt the teachings ofthe present disclosure to particular situations, applications, and/ormaterials, without departing from the essential scope thereof. Thepresent disclosure is thus not limited to the particular examplesdisclosed herein, but includes all embodiments falling within the scopeof the appended claims.

What is claimed is:
 1. A transport system in a structure comprising: acar constructed and arranged to move along a lane generally defined atleast in-part by the structure; and a plurality of motor modulesdistributed along the lane and constructed and arranged to propel thecar, each one of the plurality of motor modules including an embeddedpower module.
 2. The transport system set forth in claim 1, wherein theembedded power module includes a substrate having opposite first andsecond surfaces; a first semiconductor device embedded in the substrateand spaced between the first and second surfaces; a second semiconductordevice embedded in the substrate, spaced between the first and secondsurfaces, and spaced from the first semiconductor device; a first gatelocated on the first surface; a second gate located on the secondsurface; a first via electrically engaged to the first gate and thesecond semiconductor device; and a second via electrically engaged tothe second gate and the first semiconductor device.
 3. The transportsystem set forth in claim 2, wherein the embedded power module includesa first collector/emitter pad located on the second surface and spacedfrom the second gate; at least one third via electrically engaged to thefirst semiconductor device and the first collector/emitter pad; and atleast on fourth via electrically engaged to the second semiconductordevice and the first collector/emitter pad.
 4. The transport system setforth in claim 3, wherein the embedded power module includes a secondcollector/emitter pad located on the first surface; a thirdcollector/emitter pad located on the first surface and spaced from thefirst collector/emitter pad; at least one fifth via electrically engagedto the first semiconductor device and the second collector/emitter pad;and at least one sixth via electrically engaged to the secondsemiconductor device and the third collector/emitter pad.
 5. Thetransport system set forth in claim 1, wherein the embedded power moduleincludes: a substrate including opposite first and second surfaces; afirst semiconducting die embedded in the substrate and spaced betweenthe first and second surfaces; a second semiconducting die embedded inthe substrate, spaced between the first and second surfaces, and spacedfrom the first semiconducting die; a first gate located on the firstsurface; a second gate located on the second surface; a first viaelectrically engaged to the first gate and the second semiconductingdie; a second via electrically engaged to the second gate and the firstsemiconducting die; a first conductor pad located on the second surfaceand spaced from the second gate; at least one third via electricallyengaged to the first semiconducting die and the first conductor pad; atleast one fourth via electrically engaged to the second semiconductingdie and the first conductor pad; a second conductor pad located on thefirst surface; a third conductor pad located on the first surface andspaced from the first conductor pad; at least one fifth via electricallyengaged to the first semiconducting die and the second conductor pad;and at least one sixth via electrically engaged to the secondsemiconducting die and the third conductor pad, wherein the firstconductor pad is a phase conductor pad, the second conductor pad is a DCplus pad, and the third conductor pad is a DC minus pad